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The Jigsaw Puzzle Garden Free Download [Torrent]



 


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 . . Read More Log in or register to post commentsPopular Products Your browser's Javascript functionality is turned off. Please turn it on so that you can experience the full capabilities of this site. Your browser currently is not set to accept cookies. Please turn it on or check if you have another program set to block cookies. Prices are subject to change without notice and do not include shipping and handling. Designs, materials, features and dimensions are subject to change and may not be available or shown in various designs and colors at all times. Actual color may differ from that shown on your computer screen. We are not responsible for typographical or photographical errors. Our website uses cookies and other technologies to provide you with a better service. Read our Privacy Policy.In recent years, in a device such as an organic electroluminescence (EL) device or a photonic crystal, a metal is provided on the surface of a dielectric substance in order to improve the transmittance. However, in the case where the metal is formed on the surface of the dielectric substance, the metallic appearance is impaired and light extraction efficiency is decreased due to the increase of the reflection at the interface between the dielectric substance and the metal. In addition, a method for forming a pattern of the metal on the surface of the dielectric substance is known. For example, the metallic appearance is enhanced by reducing the reflection at the interface between the dielectric substance and the metal. According to Patent Literature 1, a dielectric substance is deposited on a glass substrate by sputtering, and then a plurality of wirings for light extraction are formed on the surface of the dielectric substance. The wirings for light extraction include a light transmissive wiring layer made of silicon nitride and a metal wiring layer covering the light transmissive wiring layer and having an inclined surface. The light transmissive wiring layer is provided so as to be in contact with an organic EL device formed on the glass substrate. In addition, in the case where a dielectric substance is deposited by sputtering, the wirings for light extraction can be formed with a width of about 1 μm to about 10 μm. However, the wirings for light extraction are formed by using the dielectric substance having a film thickness of about 20 nm to about 500 nm. Therefore, the wirings for light extraction

 

 

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The Jigsaw Puzzle Garden Free Download [Torrent]

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